Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders  

作　　者：陈茂爱 蒋元宁 D．P．Sekulic 赵慧 

机构地区：[1]Key Lab for Liquid-Solid Structure Evolution and Materials Processing（ Ministry of Education）, and Institute for Materials Joining, Shandong University, Jinan, 250061. [2]Department of Mechanical Engineering, University of Kentucky, Lexington, KY 40506, USA. [3]Creative Thermal Solutions, Inc., Urbana-Champagne, IL 61802, USA.

出　　处：《China Welding》2010年第3期16-20,共5页中国焊接（英文版）

摘　　要：SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner＇ s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pustes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner＇ s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pustes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.

关 键 词：wetting kinetics composite solder NANOPARTICLE SPREADABILITY 

分 类 号：TB383[一般工业技术—材料科学与工程] V261.34[航空宇航科学与技术—航空宇航制造工程]