电流密度对电镀铁-钨非晶合金镀层的影响  

Effects of Current Density on Electroplating Fe-W Amorphous Alloy Coatings

作　　者：侯婷[1] 周海红 郭志猛[1] 王立生[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]晋西车轴股份有限公司,太原030027

出　　处：《表面技术》2010年第5期15-18,共4页Surface Technology

基　　金：水利部948项目(201048)

摘　　要：利用电镀技术在钢基体表面制备了铁-钨非晶合金镀层。采用SEM,EDS和XRD等方法分别研究了镀层表面形貌、成分和结构随电流密度的变化规律,获取了不同电流密度下的阴极电流效率、镀层厚度和显微硬度。研究表明:随着电流密度的增加,镀层颗粒和孔隙增大,且孔隙有增多的趋势,钨含量略有降低,阴极电流效率降低,镀层增厚且硬度降低。此外,还分析了电流密度的改变引起镀层形貌、钨含量、阴极电流效率、镀层厚度和硬度发生变化的原因。Iron-tungsten amorphous alloy was electroplated on the steel by electroplating.The regular of appearance,component and structure were investigated by SEM,EDS and XRD,respectively.The current efficiency of cathode,thickness of electroplated coatings and microhardness at different current densities were obtained.Subsequently,the grain and piercing became greater when the current density increased,and these piercings were much more,meanwhile the content of tungsten,current efficiency of cathode were slightly dropped.It was found that the thickness of electroplated coatings was increased with current density but the microhardness was reverse.Moreover we also discussed the reason of these changes.

关 键 词：电镀 铁-钨非晶合金 合金镀层 电流密度 

分 类 号：TQ153.2[化学工程—电化学工业]