Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures  被引量:1

Design consideration of the thermal and electro stability of multi-finger HBTs based on different device structures

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作  者:陈延湖 申华军 刘新宇 徐辉 李玲 李惠军 

机构地区:[1]School of Information Science and Engineering,Shandong University [2]Institute of Microelectronics,Chinese Academy of Sciences

出  处:《Journal of Semiconductors》2010年第10期28-31,共4页半导体学报(英文版)

摘  要:The thermal and electro stability of multi-finger heterojunction bipolar transistors (HBTs) with different structures were analyzed and discussed simultaneously. The thermal stability of the devices with different layout structures was assessed by the DC-I V test and thermal resistance calculation. Their electro stability; was assessed by the calculation of the stability factor K based on the S parameter of the HBT. It is found that HBTs with higher thermal stability are prone to lower electro stability. The trade-off relationship between the two types of stability was explained and discussed by using a compact K-factor analytic formula which is derived from the small signal equivalent circuit model of HBT. The electro stability of the device with a thermal ballasting resistor was also discussed, based on the analytic formula.The thermal and electro stability of multi-finger heterojunction bipolar transistors (HBTs) with different structures were analyzed and discussed simultaneously. The thermal stability of the devices with different layout structures was assessed by the DC-I V test and thermal resistance calculation. Their electro stability; was assessed by the calculation of the stability factor K based on the S parameter of the HBT. It is found that HBTs with higher thermal stability are prone to lower electro stability. The trade-off relationship between the two types of stability was explained and discussed by using a compact K-factor analytic formula which is derived from the small signal equivalent circuit model of HBT. The electro stability of the device with a thermal ballasting resistor was also discussed, based on the analytic formula.

关 键 词:heterojunction bipolar transistor thermal stability electro stability 

分 类 号:TN322.8[电子电信—物理电子学] O613.71[理学—无机化学]

 

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