废旧电路板钎料吹扫去除试验研究  

Experimental Study of Molten Solder Removal from Discarded Printed Circuit Board by Blowing-off Method

作　　者：潘晓勇[1] 龙旦风[2] 杨继平[3] 李中良[1] 郅慧[1] 

机构地区：[1]四川长虹电器股份有限公司工程技术中心,绵阳621000 [2]清华大学摩擦学国家重点实验室,北京100084 [3]后勤工程学院军事供油工程系,重庆401311

出　　处：《机械工程学报》2010年第19期192-198,共7页Journal of Mechanical Engineering

基　　金：'十一五'国家科技支撑计划(2006BAF02A16);清华大学摩擦学国家重点实验室自主研究课题(SKLT09B07);四川省青年科技基金(08ZQ026-065)资助项目

摘　　要：废旧电路板拆解不但是旧元器件重用的必要步骤,而且有利于废旧电路板上不同材料物质的分类收集。现有废旧电路板拆解工艺和拆解设备难以有效拆卸插装元器件,为了实现废旧电路板的自动化拆解,提出一种基于钎料吹扫去除的废旧电路板拆解工艺,并研制了相应的钎料吹扫去除试验设备,用于辅助拆解以插装电子元器件为主的电路板。为了提高钎料去除率和焊点脱钎率,以废旧电视机主板为例,在钎料吹扫去除试验设备上进行钎料去除的正交试验,并在试验条件下确定最优的预热功率、喷嘴缝宽、压缩热气体吹扫角度和电路板运行速度等工艺参数。试验结果表明,基于钎料吹扫去除的拆解工艺能有效拆解插装元器件,焊点脱钎率可达98.1%;试验结果还表明,在采用基于钎料吹扫去除的拆解工艺中,电路板运行速度是影响钎料去除效果的最重要因素,应该适当取值以优化拆解工艺。Disassembling discarded printed circuit board （PCB） is not only an essential step in component reusing but also conducive to sorting collection of different materials.Existing discarded PCB disassembling techniques and equipment cannot dismantle through-hole devices （THD） effectively.In order to achieve automatic disassembly of discarded PCB,a solder-removal-based process is brought forward,and corresponding experimental equipment is developed for facilitating disassembly of PCB mounted mainly with THD.To increase solder-removal rate and joint-disconnection rate,the motherboard of discarded television set is taken as an example,an orthogonal experiment of solder removal is conducted on this equipment,and process parameters,such as pre-heating power,nozzle width,compressed hot air blowing angle and PCB moving speed,are optimized under the experimental conditions.Experimental results demonstrate that the solder-removal-based process is feasible and effective for dismantling THD and the joint-disconnection rate is up to 98.1%.It is also indicated that the PCB moving speed when it＇s being blown is the main factor affecting the solder removal,hence it should be appropriately controlled to optimize the solder-removal-based process.

关 键 词：废旧电路板 回收 吹扫 拆卸 元器件 

分 类 号：X705[环境科学与工程—环境工程]