热处理温度对Ni-Co-P合金镀层组织与性能的影响  

Effect of heat treatment temperature on microstructure and properties of Ni-Co-P alloy plating

作　　者：袁庆龙[1] 曹晶晶[1] 李四猛 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003 [2]平谦电子厂,广东东莞523851

出　　处：《材料热处理学报》2010年第9期73-76,共4页Transactions of Materials and Heat Treatment

摘　　要：研究了不同热处理温度对化学镀Ni-Co-P镀层组织和性能的影响。结果表明:在给定实验条件下,原始镀态Ni-Co-P镀层组织呈非晶结构胞状形态。随加热温度升高至400℃时,经XRD分析可知,镀态的非晶结构Ni-Co-P镀层发生部分晶化,析出亚稳相Ni12P5,500℃热处理后完全晶化,亚稳相转变为稳定的Ni3P相,镀层表面形貌变化不大,但当600℃热处理后镀层表面形貌由胞状变为蠕虫状。镀层硬度随热处理温度的升高先增后降,至400℃时硬度达到最高值,而后随温度的升高而下降,与组织结构的变化相吻合。研究还表明,Ni-Co-P镀层同Ni-P镀层相比,具有更优异的耐硫酸腐蚀性能。The effects of heat treatment temperature on microstructure and properties of Ni-Co-P plating on a medium carbon steel were investigated.The results show that under the given experiment conditions,the original plating presents amorphous structure with cellular morphology.As the temperature increases to 400 ℃,determined by XRD,structure of the Ni-Co-P plating is partially transformed from amorphous to crystalline and metastable phase Ni12 P5 is separated out.When temperature is to 500 ℃,full crystallization of the amorphous structure occurs,the metastable phase transforms into stable phase Ni3 P and no significant change of surface morphology is observed,however,the surface morphology of the plating changes from cellular to vermicular at 600 ℃.Microhardness of the plating increases to the mixmum value at 400 ℃ and then decreases with the increase of heat treat temperature.The corrosion resistance of the NiCo-P plating is superior to that of Ni-P plating in sulfuric acid solution.

关 键 词：Ni-Co-P合金 非晶态 胞状组织 显微硬度 耐腐蚀性 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TG146.1[金属学及工艺—金属学]