Effect of direct electric current on wetting behavior of molten Bi on Cu substrate  

作　　者：徐前刚 刘锡贝 张海峰 

机构地区：[1]Department of Materials Science and Engineering,Shenyang Institute of Aeronautic Engineering [2]Institute of Metal Research,Chinese Academy of Sciences

出　　处：《Transactions of Nonferrous Metals Society of China》2010年第8期1452-1457,共6页中国有色金属学报（英文版）

基　　金：Project(50704001) supported by the National Natural Science Foundation of China

摘　　要：The effect of direct electric current on the wetting behavior of molten Bi on Cu substrate at 370℃ was investigated by the sessile drop method. The wettability of molten Bi on Cu without an applied current is poor and the spreading time required to form the steady-state contact angle （about 102°） is approximately 30 min. With the increase of the applied electric current, the spreading of molten Bi on Cu is accelerated significantly and the steady-state contact angle decreases considerably. The cross-section SEM micrographs of the solidified Bi droplet on Cu substrate show that the electric current has a marked effect on the convection of melt. Correspondingly, the application of an electric current obviously enhances the dissolution of Cu into Bi melt, which may change the wetting triple line configuration. The improvement of wettability induced by electric current is also related to the additional driving force for wetting provided by the electromagnetic pressure gradient force.The effect of direct electric current on the wetting behavior of molten Bi on Cu substrate at 370°C was investigated by the sessile drop method.The wettability of molten Bi on Cu without an applied current is poor and the spreading time required to form the steady-state contact angle(about 102ü)is approximately 30 min.With the increase of the applied electric current,the spreading of molten Bi on Cu is accelerated significantly and the steady-state contact angle decreases considerably.The cross-section SEM micrographs of the solidified Bi droplet on Cu substrate show that the electric current has a marked effect on the convection of melt.Correspondingly,the application of an electric current obviously enhances the dissolution of Cu into Bi melt,which may change the wetting triple line configuration.The improvement of wettability induced by electric current is also related to the additional driving force for wetting provided by the electromagnetic pressure gradient force.

关 键 词：WETTING DISSOLUTION surface and interface SPREADING 

分 类 号：TG111.4[金属学及工艺—物理冶金]