Numerical simulation on thixoforging of electronic packaging shell with SiC_p/A356 composites  

作　　者：王开坤 汪富玉 陈学军 王璐 马春梅 

机构地区：[1]School of Materials Science and Engineering,University of Science and Technology Beijing [2]East China Research Institute of Electronic Engineering

出　　处：《Transactions of Nonferrous Metals Society of China》2010年第9期1707-1711,共5页中国有色金属学报（英文版）

基　　金：Project(2007AA03Z119) supported by the National High-tech Research and Development Program of China;Projects(2102029,2072012) supported by the Natural Science Foundation of Beijing,China

摘　　要：Based on the research of modem electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell.The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed.The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation.The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.

关 键 词：thixo-forming SiCp/A356 composites electronic packaging shell numerical simulation 

分 类 号：TN04[电子电信—物理电子学]