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机构地区:[1]华东理工大学无机材料系,上海200237 [2]上海耀华皮尔金顿玻璃股份有限公司,上海201315
出 处:《玻璃与搪瓷》2010年第5期6-8,共3页Glass & Enamel
摘 要:低介电常数材料分为有机和无机低介电常数材料,含氟低介电常数材料主要应用于电子行业,可以降低集成电路的漏电电流、导线之间的电容效应和集成电路发热等。选定氧化锌、氧化磷、氧化硼以及氟化钠作为低温低介电常数玻璃的原料,研究了不同ZnO、B2O3配比下的玻璃样品的介电性能和耐水性能,结果表明,随着ZnO摩尔分数的增加,材料的介电常数有所下降;随着B2O3摩尔分数的增加,材料的耐水性能有所下降。Low dielectric constant materials can be divided into organic and inorganic low -k materials. These materials are mainly used in electronics industry in order to reduce current leakage and heating of integrated circuits as well as to minimize the capacity effect between wires. The zinc oxide, phosphorus oxide, boron oxide and sodium fluoride were chosen as the raw material of glass with low melting temperature and low dielectric constant. The dielectric properties and chemical durability of the glass system were investigated. The results show that the dielectric constant decreased with the increasing of ZnO and the water resistance decreased with the increasing of B2O3.
关 键 词:NaF-ZnO-P2O5-B2O3玻璃 介电常数 耐水性
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