Fabrication of Nanostructured Electroforming Copper Layer by Means of an Ultrasonic-assisted Mechanical Treatment  

超声辅助机械处理的方法制备具有纳米结构的电铸铜层(英文)

作　　者：廖强 李卫平 刘慧丛 朱立群 

机构地区：[1]北京航空航天大学材料科学与工程学院空天材料与服役教育部重点实验室

出　　处：《Chinese Journal of Aeronautics》2010年第5期599-603,共5页中国航空学报（英文版）

基　　金：National Natural Science Foundation of China (50771010)

摘　　要：Electroformed copper layer with nanostructure is obtained using a subsequent mechanical treatment under the conditions of ultrasonic vibration according to the demand of high performance material in aeronautics. The microstructure of the electroformed copper layer is observed by optical microscope （OM）, scanning electron microscope （SEM） and transmission electron microscope （TEM）. The tensile strength is evaluated with a tensile tester. It is found that bulk crystal of electroformed copper＇s surface layer is changed to nanocrystals （about 10 nm in size） after the ultrasonic-assisted mechanical treatment （UMT） but the whole monocrystalline structure still remains. The tensile strength exhibited by the new copper layer is two times better than the regular electroformed copper layer, while the fracture strain remains constant. In addition, the strengthening mechanism of UMT process is proved to be dislocation strengthening mechanism.Electroformed copper layer with nanostructure is obtained using a subsequent mechanical treatment under the conditions of ultrasonic vibration according to the demand of high performance material in aeronautics. The microstructure of the electroformed copper layer is observed by optical microscope （OM）, scanning electron microscope （SEM） and transmission electron microscope （TEM）. The tensile strength is evaluated with a tensile tester. It is found that bulk crystal of electroformed copper＇s surface layer is changed to nanocrystals （about 10 nm in size） after the ultrasonic-assisted mechanical treatment （UMT） but the whole monocrystalline structure still remains. The tensile strength exhibited by the new copper layer is two times better than the regular electroformed copper layer, while the fracture strain remains constant. In addition, the strengthening mechanism of UMT process is proved to be dislocation strengthening mechanism.

关 键 词：electroformed copper layer NANOSTRUCTURE ultrasonic-assisted mechanical treatment tensile strength 

分 类 号：TB383.1[一般工业技术—材料科学与工程]