Bi对Sn-Zn基无铅钎料合金组织与性能的影响  

Influence of Bi on Microstructure and Properties of Sn-Zn Lead-free Solder

作　　者：陈伟[1] 胡强[1] 张富文[2] 

机构地区：[1]北京有色金属研究总院国家有色金属复合材料工程技术研究中心,北京100088 [2]北京康普锡威焊料有限公司,北京100088

出　　处：《有色金属》2010年第4期4-8,共5页Nonferrous Metals

基　　金：国家科技支撑计划项目(2006BAE03B02);科技型中小企业技术创新基金(06C26211100611;06KW1099)

摘　　要：在Sn-（5—9）Zn二元钎料合金中加入1％～3％的Bi，研究Sn-Zn—Bi三元钎料合金的组织、熔化特性及润湿性。在Sn-Zn二元钎料合金结晶过程中，Sn-（5～7）Zn二元钎料合金形成富母-Sn的初生相，随着Zn量的增加，Sn—Zn二元钎料合金形成富Zn的初生相。添加Bi明显改善了钎料合金的润湿性能，当Bi添加量为3％时改善效果最好。另外，对钎料合金进行差热分析发现少量Bi的添加对Sn—Zn系钎料合金的熔点和熔程没有明显的影响。Bi is added into Sn-（5 -9）Zn alloys with 1% -3%. and the microstruetures, melting behaviors and wetting properties of Sn-Zn-Bi system alloy are investigated. The results show that the primary β-Sn rich phase appears in Sn-（5 -7）Zn solder from the melts firstly on cooling. With addition of Zn, the primary Zn rich phase appears in the solders. The wettability of the solder is significantly improved by addition of Bi, and the best effect is achieved with 3% Bi content. In addition, there is no obvious influence on the melting points and the pasty ranges of the Sn- Zn solders by small amount addition of Bi.

关 键 词：金属材料 Sn-Zn-Bi钎料 润湿性 组织 熔点 

分 类 号：TG425[金属学及工艺—焊接]