硬质合金Ni-Cu-P化学镀工艺及镀层组织性能研究  

Research on technology and performance of electroless Ni-Cu-P plating on cemented carbide

作　　者：罗娟[1] 朱流[2] 郦剑[1] 

机构地区：[1]浙江大学材料系,浙江杭州310027 [2]台州学院机械工程学院,浙江台州318000

出　　处：《材料热处理学报》2010年第10期110-114,共5页Transactions of Materials and Heat Treatment

基　　金：浙江省科技技术厅科技计划面上项目(2008C31040);台州市科技局科技计划项目(07321)

摘　　要：采用化学镀法在YT15硬质合金表面制备Ni-Cu-P三元合金镀层,研究不同施镀工艺参数对镀速及镀层组织性能的影响。通过称重法测定镀层沉积速率,采用划痕法定性分析镀层与基体之间的结合强度,并利用扫描电子显微镜(SEM)分析比较不同pH值镀层表面和截面的组织形貌及成分。结果表明:最佳工艺参数为硫酸铜浓度1.25 g/L,pH=11,镀覆温度90℃,镀速为0.61 g/m2·min,镀层均匀致密,主要成分为Ni和Cu,镀层与基体的结合紧密,与焊锡浸润性良好,可焊性较强。The Ni-Cu-P coating was prepared on cemented carbide substrate by electroless plating.The influence of deposition parameters such as bath composition,pH and temperature on the plating rate and properties of the Ni-Cu-P coating was studied.The plating rate was measured by weighing the sample.The bond strength of the Ni-Cu-P coating with hard metal substrate was investigated by scratch test.Surface and interface morphologies of coating were characterized by scanning electron microscopy（SEM）.The results show that the optimum plating parameters are the concentration of CuSO4.5H2 O 1.25 g /L,the pH value 11 and the plating temperature 90 ℃,the plating rate reaches 0.61 g /（m2·min）.The Ni-Cu-P coating is uniform,and the main components are Ni and Cu,good metallurgical bonding between the Ni-Cu-P layer,the substrate material and the tin solder can be obtained.

关 键 词：硬质合金 Ni-Cu-P化学镀 工艺性能 

分 类 号：TG135.5[一般工业技术—材料科学与工程] TQ153[金属学及工艺—合金]