基于Moldflow手机后盖注塑模拟与成型工艺分析  

The Injection Simulation and Analysis of Molding Process for the Mobile Phone Rear Cover Based on Moldflow

作　　者：王文君[1] 葛正浩[1] 张凯凯[1] 董学敏[1] 

机构地区：[1]陕西科技大学机电工程学院,陕西西安710021

出　　处：《塑料》2010年第5期91-93,共3页Plastics

摘　　要：以手机后盖为研究对象,利用Moldflow软件,对其注射成型过程进行模拟,优化浇口位置和注射成型工艺参数并分析可能产生的缺陷。最后将结果应用于该手机后盖的模具型腔设计。经验证表明:Moldflow在设计阶段可以找出未来产品可能出现的缺陷,提高一次试模成功率,从而降低生产成本,提高生产效率。A mobile phone rear cover was studied, and Moldflow software was used to simulate the injection molding process for it. The gate location ,injection molding technological parameters and the possible flaws were analyzed. Finally the results were applied to the end of the mold cavity design. It was verified that Moldflow could find future potential defects of the products in the designing stage. It could reduce the number of trial and the production cycle, thus reduce production costs and increase productivity.

关 键 词：MOLDFLOW 手机后盖 注塑 成型工艺 参数 

分 类 号：TP391.72[自动化与计算机技术—计算机应用技术]