超临界CO_2流体环境中线路板的热分析  

Thermal analysis of printed circuit board degradation in a supercritical CO_2 environment

作　　者：刘志峰[1] 章王生[1] 张洪潮[1,2] 

机构地区：[1]合肥工业大学机械与汽车工程学院,合肥230009 [2]德克萨斯理工大学先进制造中心,美国德克萨斯州79409

出　　处：《环境科学学报》2010年第11期2229-2235,共7页Acta Scientiae Circumstantiae

基　　金：国家自然科学基金(No50575066)~~

摘　　要：在无氧环境中,当温度加热到300℃以上时,线路板中的粘接材料(溴化环氧树脂)就会发生热解反应,这是利用热解法回收废旧线路板的理论依据.在超临界CO2流体环境中,当温度达到260℃时,线路板中的环氧树脂也会发生不完全热解反应.本文建立了高温高压下线路板的热分析模型,并对线路板内部的热应力进行研究,发现其对整个反应过程起到了一定的推动作用.The bonding material used in printed circuit boards （ PCBs） ,a brominated epoxy resin,should degrade in an oxygen-free environment when the temperature is 300 ℃ or above,and this is the theoretical basis for recycling PCBs via thermal decomposition. But in the supercritical CO2 fluid environment,the epoxy resin should be incompletely pyrogenated at 260 ℃. In this paper,a thermal analysis model of PCBs under high temperature and pressure is established,so the thermal stress that exists inside PCBs is described,and the results indicate that the thermal stress can promote the delamination and decomposition of PCBs in supercritical CO2 environments.

关 键 词：超临界CO2流体 印刷线路板 环氧树脂 热解 热分析 

分 类 号：X705[环境科学与工程—环境工程]