平均电流密度对脉冲镀镍钨合金微观形貌和性能的影响  

Effect of average current density on micromorphology and properties of pulse-electroplated Ni-W alloy coating

作　　者：王永光 赵永武 陈广 倪自丰 

机构地区：[1]江南大学机械工程学院,江苏无锡214122

出　　处：《电镀与涂饰》2010年第11期8-10,共3页Electroplating & Finishing

基　　金：中央高校基本科研业务费专项资金(JUSRP10909)

摘　　要：在硫酸镍15g/L,钨酸钠30g/L,柠檬酸35g/L,烷基有机添加剂1.5g/L,pH为7,温度65°C的条件下,研究了平均电流密度对脉冲镀镍钨合金镀层的外观、结合力、显微硬度、沉积速率、镀层中钨含量及表面微观形貌的影响。结果发现,随着平均电流密度的增大,镀层中钨含量增加,镀层硬度先增大而后趋于恒值。过高和过低的平均电流密度都会引起镀层缺陷,最佳的平均电流密度为5～8A/dm2。The effect of average current density on the appearance, adhesion strength, microhardness, deposition rate, tungsten content and surface morphology of pulse- electroplated Ni-W alloy coating was studied under the conditions of NiSO4 15 g/L, Na2WO4 30 g/L, citric acid 35 g/L, organic alkyl additive 1.5 g/L, pH 7 and temperature 65 ℃. The results showed that the content of W is increased with increasing average current density while the hardness is increased initially and then levels off. Defects will be formed at very low or high average current density. The optimal average current density was found to be 5-8 A/dm^2.

关 键 词：镍钨合金镀层 脉冲电镀 平均电流密度 显微硬度 微观形貌 

分 类 号：TQ153.2[化学工程—电化学工业]