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作 者:袁诗璞
机构地区:[1]成都市机投镇会所花园A3-02-202,四川成都610045
出 处:《电镀与涂饰》2010年第11期14-18,共5页Electroplating & Finishing
摘 要:导致电镀废水CODCr超标的主要原因是难以用简易的方法去除其中的有机物。氯化钾镀锌工艺大量采用高泡型表面活性剂,造成废水中有机物过多,因此CODCr难以处理达标。现有适用于去除废水中有机物的方法在电镀厂中难以应用。建议尽量减少该工艺的使用,大力推广锌酸盐无氰碱性镀锌工艺,并开发全新的高阴极电流效率的无氰镀锌工艺。Organic compounds are difficult to be simply and easily removed from electroplating wastewater, which leads to the failure to reach the CODcr limit. The use of a large amount of surfactants with high foamability in chloride zinc plating process causes the excess of organic compounds in wastewater, resulting in the difficulty to meet CODcr quota after treatment. The methods presently available for the removal of organic compounds in wastewater are hard to be applied in many electroplating factories. It is recommended to try to avoid using chloride zinc plating process, extend the application of cyanide-free zincate zinc plating process, and develop novel non-cyanide zinc plating processes with high cathodic current efficiency.
分 类 号:TQ153.15[化学工程—电化学工业] X781.1[环境科学与工程—环境工程]
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