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机构地区:[1]东南大学电子科学与工程学院,南京210096
出 处:《电子器件》2010年第5期541-544,共4页Chinese Journal of Electron Devices
基 金:国家自然科学基金项目资助(60871015);国家"863"计划资助(2008AA03A308)
摘 要:超薄荫罩式等离子体显示屏(Plasma Display Panel,PDP)相对于传统荫罩式PDP(SMPDP),采用极薄的D263T玻璃作为前后基板,且该基板玻璃可充当介质层,因此超薄荫罩式PDP重量轻,体型薄。但由于基板玻璃非常薄,使得封接难度增大。为了验证超薄SMPDP制备的可行性及提高其封接成功率,有必要对超薄SMPDP制备工艺进行深入研究。基于超薄SMPDP的结构特点,重点关注它与普通SMPDP不同的工艺处理,如荫罩处理工艺、封接固定装置设计、封接框制作工艺、封接温度曲线等方面的研究。实验结果表明,经过上述工艺改进后,超薄SMPDP的封接成功率接近80%。Compared with the traditional Shade Mask PDP(SMPDP),the ultra-thin SMPDP uses ultra-thin D263T glass as the substrate,and the glass substrate is also used as the dielectric layer.Therefore this type of panel is very light and thin.However,the glass substrate is so thin that it is difficult for the sealing of the ultra-thin SMPDP.In order to validate the possibility in the sealing of ultra-thin SMPDP and improve the success probability,it is necessary to go deep into the manufacture technics of ultra-thin SMPDP.Based on the characteristic of ultra-thin SMPDP structure,different manufacture technics between the ultra-thin SMPDP and the traditional SMPDP,such as the shadow mask surface treatment,the design of the sealing fixtures,the manufacture of the fritting frame and the sealing temperature curve is investigated in this article.The experimental results indicate that the sealing success probability of ultra-thin SMPDP approaches 80% by the above technics improvements.
分 类 号:TN873.94[电子电信—信息与通信工程]
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