低压开关电器主电路温度场的有限元分析  

Finite Element Analysis of Temperature Field of Main Circuit in Low Voltage Apparatus

作　　者：陈维 张国钢[1] 张鹏飞[1] 张怡[1] 耿英三[1] 

机构地区：[1]西安交通大学电力设备电气绝缘国家重点实验室,陕西西安710049

出　　处：《低压电器》2010年第20期1-4,共4页Low Voltage Apparatus

摘　　要：基于有限元软件Ansys的热电耦合功能,采用导电桥模型模拟触头间电流收缩和焦耳发热,对某型低压开关电器样机的主电路进行了稳态温度场仿真计算,并通过试验验证了模型的准确性。在稳态温度场分析模型基础上,建立了开关电器瞬态温度场分析模型。使用瞬态热分析模型,对其在承受短时大电流情况下的温度分布进行了仿真,给出了判断触头静熔焊的依据,并分析了开关电器的热稳定性。仿真结果对低压开关结构优化设计提供了参考。Electric bridge model was used to simulate current constriction between contacts and joule heating effect.Based on the electric thermal analysis of the finite element software Ansys,the static temperature field of main circuit in low voltage apparatus with nominal current of 200 A was simulated.The results were verified by ex-periments.The transient thermal analysis model was built on the basis of the static thermal analysis.The tempera-ture field was simulated using the transient model when the short time high current applied.The criterion of the contact static welding was presented.The thermal stability of switchgear devices was researched.The results were useful in the designing and optimizing of low voltage apparatus.

关 键 词：低压开关电器 温度场 导电桥模型 有限元法 

分 类 号：TM57[电气工程—电器] TM561