密封继电器触点的失效模式与失效机理研究  

The Study of Failure Model and Failure Mechanism for Sealed Relay Contact Points

作　　者：张富贵[1] 陈进勇[1] 张柯柯[1] 

机构地区：[1]贵州大学机械工程学院,贵州贵阳550003

出　　处：《贵州大学学报（自然科学版）》2010年第5期47-50,共4页Journal of Guizhou University:Natural Sciences

基　　金：国家自然科学基金(31060171);贵州省科技计划项目(黔科合NY字[2010]3048号)

摘　　要：文章综述了密封继电器触点的常见失效模式,包括电弧侵蚀、粘接、熔焊、金属迁移、污染电流等;分析了各种失效模式的形成机理;最后阐明要提高密封继电器的可靠性,在密封继电器的设计、生产、使用过程中应采取的措施。The general failure models of sealed relay contacts,including electric arc corrosion,adhesion,melt weld,metal transplantation,polluted current and so on,were analyzed and the formed mechanism of all kinds of failure models was also discussed.Lastly,how to raise the reliability of the sealed relay was illustrated,during the course of design,produce and use of the sealed relay.

关 键 词：密封继电器 金属迁移 失效模式 失效机理 污染电流 

分 类 号：TM581.3[电气工程—电器]