真空热压烧结W(50)/Cu-Al_2O_3复合材料的性能研究  

Research on Properties of W(50)/Cu-Al_2O_3 Composite Prepared by Vacuum-pressed Sintering

作　　者：张晓伟[1] 田保红[1,2] 赵瑞龙[1] 刘勇[1,2] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471003

出　　处：《热加工工艺》2010年第20期63-65,共3页Hot Working Technology

基　　金：河南省高校创新人才培养工程(豫高教2005-126)项目资助

摘　　要：采用真空热压烧结工艺制备W(50)/Cu-Al2O3复合材料,观察了其显微组织,测试了其致密度、硬度、抗弯强度和导电率。结果表明:W(50)/Cu-Al2O3复合材料组织致密;致密度和硬度优于Cu-50%W,致密度可达99.8%,显微硬度达135 HV。而导电率为46%IACS,略低于W-50%Cu复合材料。抗弯强度为291.3 MPa,弥散铜钨合金室温弯曲断裂主要以弥散Cu相的撕裂为主,伴随有W-Cu界面的分离和部分W晶粒的解理断裂。W（50）/Cu-Al2O3 composite was successfully fabricated by vacuum hot-press sintering process.The density,hardness,bending strength and electrical conductivity were investigated.The results show that the microstructure of the composite is very dense,with the theoretical density of 99.8%and excellent comprehensive properties,such as microhardness 135 HV,electrical conductivity 46%IACS and bending strength 291.3 MPa.The density and microhardness are higher than those of W-50%Cu composite.The bending fracture surface shows brittle fracture mechanism due to the copper based binderfracture following the separation of tungsten-copperinterface and the cleavage of part tungsten particle.

关 键 词：热压烧结 W(50)/Cu-Al2O3 致密度 性能 断裂机理 

分 类 号：TB331[一般工业技术—材料科学与工程]