时效对Cu-Ni-Si-P合金组织和性能的影响  

Effect of Aging on Microstructure and Properties of Cu-Ni-Si-P Alloy

作　　者：张毅[1] 刘平[2] 田保红[1] 贾淑果[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]上海理工大学机械工程学院,上海200093

出　　处：《热加工工艺》2010年第20期152-155,共4页Hot Working Technology

基　　金：国家自然科学基金资助项目(50571035);国家高新技术研究发展计划(863计划)资助项目(2006AA03Z528);河南省杰出青年基金资助项目(0521001200)

摘　　要：研究了时效温度和时效时间对Cu-Ni-Si-P合金组织和性能的影响。结果表明:合金先经900℃固溶,再经不同冷变形后时效,当变形量为80%、时效温度达到450℃、时效2 h后,其显微硬度达到220 HV,导电率达到41%IACS,与未经预冷变形的合金时效相比,合金能获得较高的显微硬度与导电率。Cu-Ni-Si-P合金在较短时间时效时,析出相细小弥散分布。利用高分辨技术观察该合金在450℃时效48 h的析出相形貌,通过计算发现:析出相与基体之间保持着良好的共格关系,并通过对其进行标定,发现析出相为Ni2Si和Ni3P。The effects of aging temperature and aging time on microstructure and properties of Cu-Ni-Si-P alloy were studied.The results show that the microhardness and electrical conductivity of the alloy solution treated at 900 ℃ with 80% cold deformation and then aged at 450 ℃ for 2 h reach 220 HV and 41%IACS,respectively.The high microhardness and electrical conductivity can be obtained compared with the aged alloy without cold deformation.The second phase is dispersed afteraging forshort time.The microstructure was observed afterthe alloy aged at 450 ℃ for48 h using HRTEM.The second phase and Cu base keep well coherent relationship.The second phases are Ni2Si and Ni3P.

关 键 词：Cu-Ni-Si-P合金 时效 冷变形 显微硬度 导电率 

分 类 号：TG166.2[金属学及工艺—热处理]