Cu-Ni扩散偶的扩散溶解层  

Diffusion solution layer of Cu-Ni diffusion couple

作　　者：宋玉强[1] 李世春[1] 张振亚[1] 

机构地区：[1]中国石油大学(华东)解放军总装备部材料界面实验室,山东东营257061

出　　处：《材料热处理学报》2010年第11期23-26,共4页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金资助项目(50371059)

摘　　要：分别在普通和真空热处理炉中对Cu/Ni镶嵌式扩散偶进行退火热处理,利用扫描电子显微镜和电子探针显微分析仪观察和分析了扩散溶解层的形态和结构,并对其形成机理进行了探讨。结果表明,Cu/Ni扩散偶在950℃、100h退火处理时,Cu/Ni扩散溶解层主要在Ni块上形成,形状依附于原始界面,并逐渐向Ni块基体延伸,与Ni块没有界面,其结构是以Ni为溶剂、Cu为溶质的间隙固溶体;扩散溶解层的形成机理是Cu原子向Ni块扩散,Ni原子几乎不向Cu丝扩散,Cu丝溶解在Ni块里面。Cu /Ni diffusion couple made by inlaying copper wire in nickel was annealed in air and vacuum heat treatment furnace,respectively.The microstructure and morphology of diffusion solution layer were observed and analysed by means of SEM and EDS,and its forming mechanism was explored.The results show that Cu /Ni diffusion-solution layer is mainly formed in the Ni block,its shape depends on the original interphase interface,and it gradually extends to the Ni block,and does not exist interface with Ni after Cu /Ni diffusion couple is annealinged at 950 ℃ for 100 h.Its structure is interstitial solid solution with Ni as the solvent and Cu as the solute,the formation mechanism of diffusion-solution layer is Cu atom diffusing into Ni block,Ni atom hardly diffusing into Cu,and the Cu wire dissolving in the Ni block.

关 键 词：铜 镍 扩散层 扩散偶 扩散焊 

分 类 号：TG146.2[一般工业技术—材料科学与工程]