聚酰亚胺无胶型挠性覆铜板的卷曲及其模型  

The curvature and its model of polyimide adhesiveless flexible copper clad laminate

作　　者：庄永兵[1] 顾宜[1] 

机构地区：[1]四川大学高分子科学与工程学院,四川成都610065

出　　处：《印制电路信息》2010年第11期40-43,53,共5页Printed Circuit Information

摘　　要：用直接涂覆聚酰胺酸于铜箔的方法制作了聚酰亚胺无胶型挠性覆铜板,对无胶型挠性覆铜板发生卷曲的原因进行了分析推导,并建立了模型,用建立的卷曲模型公式成功地评估了挠性板的铜箔基材与覆于铜箔上的聚酰亚胺树脂的线性热膨胀系数之间的差值。文章还就聚酰亚胺的化学结构、聚酰亚胺薄膜的厚度及聚酰胺酸酰亚胺化工艺对卷曲程度的影响进行了初步分析和探讨。Adhesiveless two-layer flexible copper clad laminates（2L-FCCLs） were obtained by casting polyamide acid solutions onto copper foils and then carrying out a certain imidization procedure for them.The derivation of curvature in 2L-FCCLs was analyzed and deduced.To explain the reasons for curling phenomenon,the curling model was established.And the deviation of linear thermal expansion coefficient（CTE） between polyimide films and the copper substrates was successfully evaluated by the model.The influence of the chemical structure and thickness of polyimide films,imidization process of polyamide acids on the curvature in 2L-FCCLs were also preliminarily analyzed and discussed in this paper,respectively.

关 键 词：无胶型挠性覆铜板 聚酰亚胺 卷曲 模型 

分 类 号：P634.2[天文地球—地质矿产勘探]