钛-铜扩散界面及其导电性分析  

Diffuse interface and conductivity of Ti-Cu

作　　者：黄文芳[1] 杨秀琴[1] 许健[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《南方金属》2010年第5期13-15,共3页Southern Metals

基　　金：国家自然科学基金资助项目(50664005);国家高技术研究发展计划资助项目(2009AA032512);云南省科技厅联合支持项目(2009GA007)

摘　　要：通过热压扩散复合制备钛-铜复合板,研究了温度对复合界面形貌的影响.SEM分析表明扩散界面由Cu4Ti、Cu4Ti3、CuTi、CuTi2化合物相组成,同时存在2个不同衬度的Cu4Ti相层.复合板的导电性得到大幅提高,是纯钛的13.2～15.7倍.The Ti-Cu composite plates were fabricated by hot-pressing-diffusion compounding technology,and the effects of temperature on the interface morphology were investigated using scanning electron microscope（SEM）.It was found that the diffusion layers consisted of Cu4Ti、Cu4Ti3、CuTi、CuTi2,and there were layers of Cu4Ti with different contrast.The conductivity of the Ti-Cu composites was as high as 13.2 to 15.7 times that of the pure Ti.

关 键 词：热压扩散 钛-铜复合板 化合物 导电性 

分 类 号：TG146[一般工业技术—材料科学与工程]