电子组装中胶黏剂及其涂覆工艺的选择(续完)  

Selection of Adhesive and Coating Process in Electronic Assembly

作　　者：史建卫 许愿 王建斌 

机构地区：[1]日东电子科技(深圳)有限公司,广东深圳518103 [2]德邦科技有限公司,山东烟台264006

出　　处：《电子工艺技术》2010年第6期369-372,共4页Electronics Process Technology

摘　　要：胶黏剂在混装及双面回流焊接工艺中主要是把元器件固定于电路板底面,以便进行波峰焊或双面回流焊工艺。常用的胶黏剂涂覆方法包括针转移法、点涂法和丝网印刷法/模板印刷法。模板印刷法近年来在大批量高速流水线生产中得到了较为广泛的应用。主要介绍了胶黏剂的涂覆工艺及选择、胶黏剂的性能及选择和胶黏剂的相关工艺设计,并对其进行了较为详细的分析。The adhesive in the mixed and double-sided reflow soldering process is mainly used to fix the component on the bottom-side of print circuit board for wave soldering or double-sided reflow process.The adhesive coating methods used commonly include needle transfer method,dispense method and screen printing/stencil printing method.The stencil printing method in recent years has been more widely used in mass production of high-speed line.Introduce the coating process and choice of adhesive,the properties and selection of adhesive,a more detailed analysis for the process design

关 键 词：胶黏剂 针转移 点涂 模板印刷 

分 类 号：TN604[电子电信—电路与系统]