低熔体黏度聚酰亚胺树脂的合成和性能  

Synthesis and Characterization of Melt-Processable High Temperature Polyimide Resins

作　　者：杨慧丽[1] 孟祥胜[1] 范卫锋[1] 刘敬峰[1] 王震[1] 

机构地区：[1]中国科学院长春应用化学研究所高分子物理与化学国家重点实验室,长春130022

出　　处：《宇航材料工艺》2010年第2期41-44,共4页Aerospace Materials & Technology

基　　金：973计划资助项目(201020CB631101;2010CB631102);吉林省科技发展计划项目(20080110)

摘　　要：合成了两种以苯乙炔基封端的聚酰亚胺树脂,并对其熔体黏度、热性能和力学性能进行了研究。结果表明,两种树脂在280℃/2h的熔体黏度均小于1Pa.s,并具有良好的熔体黏度稳定性,可以用RTM的方法加工成型。PI-1树脂的Tg和T5d分别是402和534℃,PI-2树脂的Tg和Td5分别是356和525℃。碳纤维增强的PI-1基复合材料在300℃下具有大于70%的性能保持率。Two series of phenylethynyl end-capped polyimide oligomers were synthesized and their thermal and rheological and mechanical properties were characterized. The results show that two oligomers exhibit low complex melt viscosity （ 1 Pa·s） at 280℃/2 h and are stable at this temperature.These two oligomers can be processed by resin transfer molding techniques. Tg and T5d of PI-1 resins are 402℃ and 534℃ respectively, PI-2 resins are 356℃ and 525℃ respectively. The retention rates of properties of PI-1 resin/carbon fabric composite are beyond 70% at 300℃.

关 键 词：聚酰亚胺 RTM 熔体黏度 耐热性 力学性能 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]