测辐射热计红外焦平面列阵  

Bolometer Infrared Focal Plane Arrays

作　　者：杨亚生[1] 

机构地区：[1]重庆光电技术研究所

出　　处：《半导体技术》1999年第2期5-8,共4页Semiconductor Technology

摘　　要：非制冷测辐射热计红外焦平面列阵设计为桥式结构，器件制作采用微机械加工技术。工作波段为８～１２μｍ，热阻达１０７Ｋ／Ｗ量级，噪声等效温差为０．１Ｋ。Uncooled bolometer infrared focal plane arrays with high performance and low cost is designed with bridge structure.The device is fabricated by means of micromachined process technology.The operation wavelength region of 8￣12μm is achieved,with the thermal resistance of 10 7K/W order and the noise equivalent temperature difference of 0 1K.

关 键 词：测辐射热计 桥式结构 热阻 红外焦平面列阵 

分 类 号：TN215.03[电子电信—物理电子学]