酸性镀铜液中硫酸含量的自动电位滴定  

Determination of Free Sulphuric Acid in Acid Copper Plating Bath by Automatic Potentiometeric Titration

作　　者：丘山 丘圣 曾家民 丘星初 

机构地区：[1]广州安纳环境分析测试有限公司,广州番禺511400

出　　处：《涂装与电镀》2010年第6期30-31,25,共3页Painting and Electroplating

摘　　要：研究了用自动电位滴定法测定酸性镀铜液中硫酸含量的条件和方法。实验结果表明,与用甲基橙为指示剂的手动滴定法相比,提高了分析的准确度和精密度,而且分析操作简便快捷。This paper had studied on the conditions and method of free sulphuric acid delermination in acid copper pla in ting bath by automatic potentiometeric titration. Test show that this method raise analytical accuracy and precision comparsion with hamdwork titration method,This method is simple and fast

关 键 词：硫酸测定 自动电位滴定法 酸性镀铜溶液 

分 类 号：TQ223.21[化学工程—有机化工]