锡杂质对镀镍溶液的影响  

Effect of Tin Impurity on Nickel Plating Solution

作　　者：郭崇武[1] 李建强[1] 

机构地区：[1]广州超邦化工有限公司,广东广州510460

出　　处：《涂装与电镀》2010年第6期32-33,共2页Painting and Electroplating

摘　　要：研究了锡杂质对镀镍溶液的不良影响。实验表明,当亚锡离子质量浓度≥30mg/L,霍尔槽试片低电流密度区发黑。一些络合剂能络合镀镍溶液中的亚锡离子,消除锡杂质对镀液的不良影响。向镀液中加4mL/L络合型镀镍除锌剂,能够掩蔽100mg/L的亚锡离子,用抗坏血酸掩蔽法也能够消除锡杂质的不良影响。Adverse effect of tin impurity on nickel plating solution was studied. Experiments indicate that, Hull cell test plate is dark in the low current density area when Sn^2＋ ion concentration ≥ 30 mg/L. The adverse effect of tin impurity can completely eliminated with some complexing agents that react with Sn^2＋ ions to form complex compounds. Adding a zinc suppressant of 4 mL/L to the nickel plating bath can mask 100 mg/L tin impurity. The tin impurity can also be masked with L- ascorbic acid.

关 键 词：镀镍溶液 锡杂质 不良影响 络合剂 掩蔽法 

分 类 号：TQ153.12[化学工程—电化学工业]