芯片共晶焊接焊透率测量系统改进研究  

A Study on Improvement Measurement System of Complete Welding Speed in Chip Eutectic Welding

作　　者：胡永芳[1] 姜伟卓[1] 丁友石[1] 严伟[1] 

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《现代雷达》2010年第11期97-100,共4页Modern Radar

摘　　要：X射线检测设备是功率芯片焊后空洞率检测的有效手段。文中介绍了X射线设备的检测原理和超声扫描设备检测原理,通过多次不定期的进行样件X射线检测,发现其测量系统分析不太稳定,对测量真值、测量的重复性和再现性不能控制。后经制订标样,采用超声扫描设备进行标样的空洞率检测,将超声扫描检测值作为真值进行X光设备的参数确定,从而再对未知芯片进行空洞率检测。试验结果表明:将超声扫描检测值作为X光检测设备的标定样,此方法测量出的空洞率值能够通过MINTAB软件中Gage R&R测量系统分析,测量值是真实可靠的,对产品的工艺检验评价起到了至关重要的作用。X ray is the effective way to test complete welding speed in power chip eutectic welding.Detecting theory of X ray equipment and ultrasonic scanning equipment are introduced in the paper.By X ray detecting of many specimens aperiodically,it is indicated that measurement system analysis is not steady,measure real value,repeatability and reappearance can′t be controlled.By making normal specimens,firstly voidage of normal specimen is detected by ultrasonic scanning equipment,secondly ultrasonic scanning voidage value is set as real value to guide X ray parameters settings,lastly voidage detecting of unknown chip is done.The results show that by using ultrasonic scanning voidage value as real value,voidage values are tested by X ray which can be satisfied by Gage RR measurement system analysis of MINTAB software.Measured values are real and reliable,which play an important role in product process evaluation.

关 键 词：共晶焊接 焊透率 测量系统分析 

分 类 号：TN405[电子电信—微电子学与固体电子学]