Prospects of a β-SiC based IMPATT oscillator for application in THz communication and growth of aβ-SiC p-n junction on a Ge modified Si〈100〉substrate to realize THz IMPATTs  

作　　者：Moumita Mukherjee Nilratan Mazumder 

机构地区：[1]Centre of Millimeter-Wave Semiconductor Devices and Systems,Centre of Advanced Study in Radiophysics and Electronics,University of Calcutta,Girish Vidyaratna Lane,Kolkata 700009,West Bengal,India [2]IERCEM Institute of Information Technology,West Bengal University of Technology,Kolkata 700017,India

出　　处：《Journal of Semiconductors》2010年第12期20-27,共8页半导体学报（英文版）

摘　　要：The prospects ofa p＋nn＋ cubic silicon carbide （3C-SiC/fl-SiC） based IMPATT diode as a potential solidstate terahertz source is studied for the first time through a modified generalized simulation scheme. The simulation predicts that the device is capable of generating an RF power output of 63.0 W at 0.33 THz with an efficiency of 13%. The effects of parasitic series resistance on the device performance and exploitable RF power level are further simulated. The studies clearly establish the potential of 3C-SiC as a base semiconductor material for a high-power THz IMPATT device. Based on the simulation results, an attempt has been made to fabricate β-SiC based IMPATT devices in the THz region. Single crystalline, epitaxial 3C-SiC films are deposited on silicon （Si） （100） substrates by rapid thermal chemical vapour deposition （RTPCVD） at a temperature as low as 800 ℃ using a single precursor methylsilane, which contains Si and C atoms in the same molecule. No initial surface carbonization step is required in this method. A p-n junction with an n-type doping concentration of 4 × 10^24 m-3 （which is similar to the simulated design data） has been grown successfully and the characterization of the grown 3C-SiC film is reported in this paper. It is found that the inclusion of Ge improves the crystal quality and reduces the surface roughness.The prospects ofa p＋nn＋ cubic silicon carbide （3C-SiC/fl-SiC） based IMPATT diode as a potential solidstate terahertz source is studied for the first time through a modified generalized simulation scheme. The simulation predicts that the device is capable of generating an RF power output of 63.0 W at 0.33 THz with an efficiency of 13%. The effects of parasitic series resistance on the device performance and exploitable RF power level are further simulated. The studies clearly establish the potential of 3C-SiC as a base semiconductor material for a high-power THz IMPATT device. Based on the simulation results, an attempt has been made to fabricate β-SiC based IMPATT devices in the THz region. Single crystalline, epitaxial 3C-SiC films are deposited on silicon （Si） （100） substrates by rapid thermal chemical vapour deposition （RTPCVD） at a temperature as low as 800 ℃ using a single precursor methylsilane, which contains Si and C atoms in the same molecule. No initial surface carbonization step is required in this method. A p-n junction with an n-type doping concentration of 4 × 10^24 m-3 （which is similar to the simulated design data） has been grown successfully and the characterization of the grown 3C-SiC film is reported in this paper. It is found that the inclusion of Ge improves the crystal quality and reduces the surface roughness.

关 键 词：cubic （β）-SiC single drift IMPATT diode parasitic resistance terahertz oscillation RTPCVD growth p-n junction formation 

分 类 号：TN752[电子电信—电路与系统]