表面沉积镍的低碳钢在3.5%NaCl溶液中的电化学行为  

Electrochemical Behavior of Nickel-Plated Mild Steel in 3.5%NaCl Solution

作　　者：王毅[1,2] 盛敏奇[1] 钟庆东[1,2] 钮晓博[1,2] 林海[1] 范成诚[1] 

机构地区：[1]上海大学材料科学与工程学院,上海200072 [2]上海电力学院能源与环境工程学院,上海200090

出　　处：《腐蚀科学与防护技术》2010年第6期490-494,共5页Corrosion Science and Protection Technology

基　　金：国家自然科学基金项目(50571059;50615024);教育部新世纪优秀人才支持计划项目(NCET-07-0536)和教育部创新团队计划项目(IRT0739)资助

摘　　要：用电位-电容测试结合Mott-Schottky分析技术以及电化学阻抗方法研究表面沉积镍的低碳钢在3.5%NaCl溶液中的电化学行为.结果表明,裸碳钢电极在3.5%NaCl溶液中表面空间电荷层电容C_(sc)随测试电位升高逐渐增大,并且表现出p型半导体的导电特性;沉积镍的低碳钢表面空间电荷层电容C_(sc)随沉积镍的条件及扫描电位的不同有所变化,并且表面沉积镍会改变低碳钢在3.5%NaCl溶液中的半导体导电特性.In this paper,capacitance-potential measurement and Mott-Schottky analysis and electrochemical impedance technique were used to study the electrochemical behavior of nickelplated mild steel in 3.5%NaCl solution.The results showed that the surface space charge layer capacitance C_（sc） of the mild steel electrode in 3.5%NaCl solution,showing a p-type semiconducting in nature,gradually increased with the increasing of the tested potential.Also,the surface space charge layer capacitance C_（sc） of the deposition of nickel-low carbon steel changes as the change in deposition conditions of nickel and scanning potential as well.At the same time,nickel plating can change the semiconducting properties of semiconductors of the electrode system of nickel plated mild steel in 3.5%NaCl solution.

关 键 词：表面沉积 碳钢 电位-电容 Mott-Schottky 电化学阻抗谱 

分 类 号：TG174[金属学及工艺—金属表面处理]