用DTA研究环氧树脂固化反应动力学  

A Study of Curing Reaction Kinetics of Epoxy Resin by DTA

作　　者：梁舒萍[1] 

机构地区：[1]佛山科学技术学院

出　　处：《化学与粘合》1999年第2期60-63,共4页Chemistry and Adhesion

摘　　要：本文用ＤＴＡ和ＦＩＲ研究双酚Ａ二缩水甘油醚型环氧树脂与２－乙基－４－甲基咪唑固化反应动力学，探讨了固化反应的机理。结果表明：此固化反应是分步进行的。第一步是加成反应，第二步是催化聚合反应，由此确定适宜采用分段固化工艺。通过ＤＴＡ曲线推得固化工艺温度，并计算固化反应各步活化能：Ｅ１＝３６８ｋＪ．ｍｏｌ－１，Ｅ２＝５３９ｋＪ．The curing kinetics of bisphenol a diglycidyl ether type epoxy resin (DGEBA) cured with 2 ethyl 4 methylimidazole (EMI 2,4) was studied by DTA FIR in this paper. The mechanism of curing reaction was also investigated. The results of DGEBA cured with EMI 2,4 showed that the reaction carried out on two stages. The first stage was addition, the second stage was catalytic polymerization. A staged curing technology was suitable for the epoxy curing systems. The curing technological temperature was inferred by DTA curve. The activation energy of each step of curing reaction were calculated:E 1=36 8kJ.mol -1 ,E 2=53 9kJ.mol -1 .

关 键 词：DTA 环氧树脂 固化反应 动力学 

分 类 号：O633.13[理学—高分子化学]