时效处理对Sb改性的Sn-58Bi低温无铅钎料的影响  

Effect of aging treatment on Sb modified Sn-58Bi low-temperature lead-free solders

作　　者：许磊[1] 张宇鹏[1] 张宇航[1] 易江龙[1] 杨凯珍[1] 

机构地区：[1]广东省工业技术研究院(广州有色金属研究院),广东广州510650

出　　处：《材料研究与应用》2010年第4期542-545,共4页Materials Research and Application

基　　金：广州有色金属研究院创新项目(1683025);广州有色金属研究院博士基金(1683017)

摘　　要：为提高共晶锡铋钎料的延展性,细化组织,制备了Sn-58BiSb钎料合金.考察了时效处理对Sn-58Bi钎料微观组织、微量元素Sb对润湿性能的影响.结果表明,添加微量元素Sb能提高Sn-58Bi钎料的润湿性能.在85℃时效处理96h条件下,粗大的块状Bi全部消融,呈颗粒状态分布均匀.表明,时效处理可作为提高SnBi合金延伸性的有效手段.To increase the elongation rate and refine the microstructure of Sn58Bi alloys,Sn58BixSb eutectic alloys were prepared.Effect of Sb content and aging treatment the key properties,such as microstructures,wettability were investigated.The test results indicated that the microstructure of the Sn-58Bi solder with adding a trace amount of Sb was better,the wettability was obviously improved when the alloys were aged at 85℃ for 48 hours,moreover bismuth in nubbly shape was melt completely and distributed uniformly in grain shapes after the aging treatment,which indicated aging treatment could be a effective way to increase the extensibility of Sn58Bi alloys.

关 键 词：Sb掺杂 微观组织 时效处理 润湿性能 

分 类 号：TG425[金属学及工艺—焊接]