W-Fe-Ni合金与铜HIP扩散连接技术研究  

Diffusion Bonding of W-Fe-Ni Alloys to Cu by HIP Processing

作　　者：陈艳平[1] 王锡胜[1] 叶林森[1] 谢金华[1] 颜宏伟[1] 

机构地区：[1]中国工程物理研究院,绵阳621900

出　　处：《材料导报（纳米与新材料专辑）》2010年第2期240-242,共3页

摘　　要：以高纯Ti箔作中间过渡层材料,在QIH16型热等静压机内扩散连接W-Fe-Ni合金与紫铜材料。采用SEM对连接界面的元素分布进行了分析,测试了不同温度下连接件的拉伸强度,并分析了连接过程中元素的扩散特点。结果表明,采用145MPa/1050℃/120min热等静压工艺可成功实现W-Fe-Ni合金与铜的冶金结合,随HIP温度升高,界面元素扩散越充分,结合强度更高。Diffusion bonding of W-Fe-Ni alloys to pure Cu have been achieved by HIP processing, adopted with high pure Ti foils as the inter-layer materials. The SEM is used to analyze the elements distribution profiles of the interface phases. The bonding strength of the diffusion bonding samples are measured by tensile tests, and the character of elements distribution during the bonding process is analyzed. Results show that W-Fe-Ni alloys to pure Cu are suc cessfully accomplished at the pressure of 145MPa and 1050 C for 120 minutes. With increasing the HIP temperature, the diffusion degree of the interface elements is augmented, the bonding strength increascs.

关 键 词：W-Fe-Ni合金 铜 热等静压 扩散连接 

分 类 号：TP332[自动化与计算机技术—计算机系统结构]