外墙保温层与抗裂层粘结质量的红外热像检测  

Checking on adhesion quality between thermal insulation layer and anti-crack layer in outer-wall by infrared thermal image technique

作　　者：陈炜[1,2] 江晨晖[2] 刘继状 

机构地区：[1]浙江工业大学建工学院 [2]浙江建设职业技术学院

出　　处：《山西建筑》2011年第3期186-188,共3页Shanxi Architecture

基　　金：浙江建设职业技术学院科研基金资助项目(项目编号:200811)

摘　　要：以玻化微珠保温砂浆外墙外保温系统的小尺寸简化试样为对象,借助红外热成像手段,对抗裂层与保温层之间的空鼓缺陷和粘结质量进行了试验研究,结果发现热图像可清晰反映出抗裂层粘结缺陷的具体位置和几何尺寸,且缺陷部位的温度与其平面尺寸成正向相关性。With small-size simplified samples of exterior insulation system for outer-wall made of glazed hollow bead mortar as the object,using infrared thermal imaging technique,the adhesion quality between thermal insulation layer and anti-crack layer is primarily laboratorially inspected.The results showed that infrared thermal images can clearly reflect the specific locations and geometry of hollow defects in anti-crack layer,and moreover,the temperatures are directly proportional to geometrical sizes of hollow defects.

关 键 词：红外热像法 玻化微珠 抗裂层 保温层 温度 

分 类 号：TU111.4[建筑科学—建筑理论]