酸性镀铜液中氯离子的自动电位滴定  

Determination of Chloride Ion in Acidic Copper Plating Bath by Automatic Potentiometric Titration

作　　者：丘山 丘圣[2] 曾家民 丘星初 

机构地区：[1]中联环保科技开发有限公司,广东番禺511483 [2]江西环境工程职业学院,江西赣州341000

出　　处：《材料保护》2010年第12期70-71,共2页Materials Protection

摘　　要：采用自动电位滴定法测定酸性镀铜溶液中的氯离子,研究了镀液中各种成分对测定的影响。本方法简便、快捷,分析结果准确可靠。Chloride ion in acidic Cu plating bath was determined using automatic potentiometric titration.The effect of various ingredients in the plating bath on precision and accuracy of measurement was investigated.Results show that automatic potentiometric titration can be readily used to determine chloride ion in acidic Cu plating bath with convenience as well as good accuracy and reliability.

关 键 词：氯离子测定 自动电位滴定法 酸性镀铜溶液 

分 类 号：O657.1[理学—分析化学]