无铅镉化学镍沉积及其表征  

Electroless Deposition and Characterization of Nickel Coating in Lead-and Cadmium-free Bath

作　　者：杨防祖[1] 陈明辉[1] 黄夏菁[1] 田中群[1] 周绍民[1] 

机构地区：[1]厦门大学固体表面物理化学国家重点实验室,化学化工学院,福建厦门361005

出　　处：《电化学》2010年第4期430-435,共6页Journal of Electrochemistry

基　　金：福建省科技计划项目(2009H4020);国家自然科学基金项目(20873114,20833005);973项目(2009CB930703)资助

摘　　要：优化无铅、无镉化学镍沉积工艺,应用扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)和电化学方法表征化学镀镍层的形貌、组成、结构和电化学活性.结果表明,化学镍自催化沉积速率为22.4μm.h-1;沉积速率随溶液温度和pH值的提高而增大;比之硫酸镍,次磷酸钠对沉积速率的影响明显许多.化学镀镍层磷含量为7.8%(by mass),结构致密、晶粒细小,呈非晶态结构.在NaCl溶液中,镀层呈现良好的电化学耐蚀性.Technology of electroless nickel deposition in lead-and cadmium-free bath was developed.Coating′s morphology,composition,structure and electrochemical activity were characterized by SEM,EDS,XRD and electrochemical methods.The results showed that,the deposition rate of nickel in self-catalysing was 22.4 μm·h-1,which was increased by the increase of bath temperature and pH value.The effect of sodium hypophosphite on deposition rate was much more remarkable compared with nickel sulfate.The obtained nickel coating was 7.8% in phosphor weight content,having compact and neat surface morphology,amorphous structure,and good electrochemical corrosion resistance in sodium chloride solution.

关 键 词：化学沉积 镍 无铅 无镉 形貌 结构 电化学活性 

分 类 号：TQ153.12[化学工程—电化学工业]