半导体及IC设备不锈钢表面技术研究  

Surface Technique Study of the Stainless Steel About the Semiconductor and IC Equipments

作　　者：方刚[1] 王茂林[1] 祝恒阳[1] 

机构地区：[1]北京七星华创电子股份有限公司MFC研发中心,北京100016

出　　处：《电子工业专用设备》2010年第12期18-25,30,共9页Equipment for Electronic Products Manufacturing

基　　金：国家科技重大专项资助项目(极大规模集成电路制造装备及成套工艺)(2008ZX02106)

摘　　要：介绍了半导体及IC产业设备之关键不锈钢零部件的表面处理工艺方法,重点叙述了国外200 mm(8英寸)以上半导体及IC工艺设备为了避免特殊环境的腐蚀和颗粒的产生而采用的最为先进的表面处理EP工艺技术,诠释了半导体及IC产业设备零部件超高纯(UHP)技术指标要素,另外对我国目前半导体及IC行业的表面处理现状进行了研究和分析,并提出了努力方向。The current method of the surface processing for the stainless steel parts of SEMI and IC industry equipments was introduced more completely,the most Developed surface processing EP craft technique about foreign SEMI and IC equipments over 200 mm（8 inches） in order not to the creation but adoption of the grain and corrosion of special environment was described,the Ultra-High Purity（UHP）＇s technique factor of parts about SEMI and IC industry equipments was explained,another our country present condition of the surface processing about SEMI and IC industry was investigated,and a diligent direction was put forward.

关 键 词：半导体及IC设备 表面技术 EP 超高纯(UHP) 研究 

分 类 号：TN304[电子电信—物理电子学]