有机发光器件(OLED)封装技术的研究现状分析  

The Analysis about Encapsulating Technology of OLED

作　　者：王振国[1] 高健[1] 赵伟明 谭国良 

机构地区：[1]广东工业大学机电工程学院,广东广州510006 [2]东莞宏威数码机械有限公司,广东东莞523656

出　　处：《现代显示》2011年第1期27-31,共5页Advanced Display

摘　　要：有机发光器件(OLED)诞生至今,封装方式一直是提高其寿命和稳定性的重要因素之一,也是当前研究的热点。从最初的后盖式封装发展到现在的薄膜封装,其寿命和稳定性也随之提高,人们幻想的柔性显示也成为了现实。新的有效封装方法的出现使有机发光器件从实验室走进了人们的日常生活,并有望成为下一代显示器的主流。文章重点介绍了当今主要的封装技术和方法,提出了结合传统后盖式封装和薄膜封装的混合封装方法。Since the birth of organic light emitting device encapsulation has been one of the important factors to their life and stability,but also a research focus.From the back cover of the first type of encapsulation developed to thin film encapsulation,their life and stability are improved,thus people＇s fantasy about flexible display become a reality.The emergence of new and effective method of encapsulating of organic light emitting device push it from the lab into people＇s daily lives,and is expected to become the mainstream of next-generation display.This article focuses on today＇s encapsulating technology and methods of OLED,and proposed combining back cover encapsulation of traditional styles and thin film encapsulation,named hybrid encapsulation.

关 键 词：有机发光器件 后盖封装 薄膜封装 混合封装 

分 类 号：TN383[电子电信—物理电子学]