光电器件薄膜附着力评价方法的研究进展  

Recent Progress in Evaluation of Thin Film Adhesion in Optoelectronic Devices

作　　者：钱大憨[1,2,3] 贾嘉[1,2] 陈柳炼[1,2,3] 刘福浩[1,2,3] 刘飞[1,2,3] 张立瑶[1,2,3] 叶柏松[1,2,3] 李向阳[1,2] 

机构地区：[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083 [2]中国科学院上海技术物理研究所中科院红外成像材料与器件重点实验室,上海200083 [3]中国科学院研究生院,北京100039

出　　处：《红外》2011年第1期10-15,共6页Infrared

基　　金：国家自然科学基金(60907048);上海市自然科学基金(09ZR1436200)

摘　　要：薄膜与衬底的结合性能一直备受关注。在各种情况下,薄膜的性能都依赖于其与衬底的附着力大小。为了提高附着强度,需要深刻理解附着力的机理和开发合适的附着力测试技术。从基准附着力、热力学附着能和实际附着力三个不同角度提供了附着力评价途径。作为广泛使用的附着力粘接测试技术,拉脱法和压带剥落法等方法在大量样品测试方面具有独特优势,可定性、半定量地评价薄膜附着性能。The characteristics of the adhesion between a thin film and its substrate have been being much concerned.The performance of the thin film depends on the adhesion between the film and its substrate in all cases.To enhance the adhesion,the adhesion mechanism should be understood fully and the appropriate technology for measuring adhesion is required.The adhesion is evaluated in terms of basic adhesion,thermodynamic adhesion energy and actual adhesion.As the widely used adhesion test technologies,the pull-off test and peel test methods show their unique superiority in dealing with a large number of samples and can be used to evaluate the adhesion performance of thin films qualitatively and semi-quantitatively.

关 键 词：薄膜 附着力 粘接法 光电器件 测试技术 

分 类 号：O484.2[理学—固体物理]