Thermal analysis of LED lighting system with different fin heat sinks  

作　　者：侯峰泽 杨道国 张国旗 

机构地区：[1]School of Mechanical & Electrical Engineering Guilin University of Electronic Technology [2]philips Lighting,Eindhoven,the Netherlands

出　　处：《Journal of Semiconductors》2011年第1期50-52,共3页半导体学报（英文版）

基　　金：Project supported by the National Natural Science Foundation of China(No.60666002)

摘　　要：This paper designs a 3 × 3 light emitting diode （LED） array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element （FE） model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately.This paper designs a 3 × 3 light emitting diode （LED） array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element （FE） model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately.

关 键 词：LED thermal design LED array heat sink 

分 类 号：TM923.34[电气工程—电力电子与电力传动]