电镀液和电镀层中铜和锰的联合测定  

Combined Determination of Copper and Manganese in Electroplating Solution and Electroplated Layer by Spectrophotometry

作　　者：王尊本[1] 王润棠[1] 

机构地区：[1]厦门大学化学系教育部材料和生命过程分析科学开放研究实验室

出　　处：《厦门大学学报（自然科学版）》1999年第4期562-568,共7页Journal of Xiamen University：Natural Science

摘　　要：当ｐＨ＝１０时，铜和锰都能与ＰＡＲ生成稳定的红色络合物；当ｐＨ＝７时，锰与ＰＡＲ几乎不络合，而铜与ＰＡＲ则可以稳定络合．利用这种差异，可以在ｐＨ＝１０的介质中测定铜和锰的合量，而在ｐＨ＝７的介质中测定铜的量，再由两者之差求得锰的含量．试验表明，ｐＨ＝１０．０时，εＣｕ－ＰＡＲ４９８．５＝４．６６×１０４Ｌ／ｍｏｌ·ｃｍ；εＭｎ－ＰＡＲ４９８．５＝８．００×１０４Ｌ／ｍｏｌ·ｃｍ；ｐＨ＝７．０时，εＣｕ－ＰＡＲ４９８．５＝４．２６×１０４Ｌ／ｍｏｌ·ｃｍ．相对标准偏差小于３％，回收率为９５％～１０１％．Cu 2+ and Mn 2+ can complex with PAR to form stable red compounds at pH = 10.0. At lower pH values, Mn 2+ cann′t complex with PAR ,while Cu PAR is still stable and remains a relatively high absorbance. According to this difference , Cu 2+ and Mn 2+ can be determined at different pH in the aqueous phase by spectrophotometry. The molar absorptivities of the two complexes are found to be 4.66×10 4 L/mol·cm (for Cu 2+ at pH=10.0), 4.26×10 4 L/mol·cm(for Cu 2+ at pH=7.0) and 8.00×10 4 L/mol·cm(for Mn 2+ at pH =10.0) respectively. The relative standard deviations are less than 3 % and the recoveries are 95%～101% .This method is applied to determine the content of Cu and Mn in the electroplating solution and electroplated layer.

关 键 词：电镀液 电镀层 铜 锰 分光光度法 测定 

分 类 号：TQ153[化学工程—电化学工业] O657.3[理学—分析化学]