Ti／Cu接触反应液相层等温凝固过程研究  

Study on Phase Layer Isothermal Solidification Process of Ti/Cu Contact Reaction Liquid

作　　者：王艳芳[1] 

机构地区：[1]陕西工业职业技术学院材料工程学院,陕西咸阳712000

出　　处：《陕西工业职业技术学院学报》2010年第4期10-13,共4页Journal of Shaanxi Polytechnic Institute

摘　　要：针对Ti／Cu接触反应液相层在等温凝固过程中的组织形貌、反应相及成分分布规律进行研究。以Cu／Ti／Cu嵌入式整体结构试验件为试验对象，采用连接温度为900℃，保温时间分别为40、60、240、480min进行等温凝固试验。研究等温凝固过程中，Ti／Cu扩散偶界面微观组织形貌的演变过程、反应相出现以及成分分布规律。结果表明，液相的等温凝固过程不单单是液／目界面向前推进的过程，也有液相内部固相的形核并长大；由于成分的局部起伏，也同时存在熔化现象；液相在凝固收缩界面的同时，也发生了向固相内部的溶蚀渗透。这些现象均有助于促进等温凝固过程的进行。This paper studies on structure and morphology, reaction phase and component distribution regularity of Ti/Cu contact reaction liquid phase layer during the isothermal solidification process. The test was made by useing Cu/Ti/Cu embedded integral structure as test piece, made experiment at bonding temperature 900？ C for 40, 60, 240, 480 minutes isothermal solidification respectively. The Ti/Cu diffusion couple＇s evolution process, reaction phase appearing and component distribution regularity during the isothermal solidification process were studied. The results showed that the liquid isothermal solidification is a process of not only moving the liquid/solid interface inward, but also crystallization inside; fusion occurred at the same time while solidifying, owing to local composition fluctuations; at the same time of liquid phase at the solidifying contraction interface, the corrosion osmosis toward solid phase was also happened. All the phenomenons are helps for expediting the process of isothermal solidification.

关 键 词：瞬间液相扩散焊 Cu/Ti/Cu 等温凝固 

分 类 号：TG401[金属学及工艺—焊接]