电流密度对紫铜基体电沉积Fe-W合金的影响  

Effect of Current Density on Electrodeposited Fe-W Alloy Coating on Red Copper

作　　者：侯婷[1] 郭志猛[1] 王立生[1] 方哲成[1] 

机构地区：[1]北京科技大学粉末冶金研究所,北京100083

出　　处：《材料保护》2011年第1期16-18,6,共3页Materials Protection

摘　　要：针对目前Fe-W合金镀层中W含量较低致使镀层硬度不高的问题,通过电沉积法在铜表面沉积Fe-W合金,获得了一种W含量较高、表面致密且高硬度的非晶合金涂层。用SEM,XRD和EDS表征了镀层形貌、结构和成分,并测定了镀层的显微硬度。结果表明:不同电流密度下镀层均为非晶结构,形貌为圆球状颗粒;镀层厚10～100μm;随着电流密度增大,镀层中孔隙增多,其中W质量分数达57%～61%;电流密度为10 A/dm2时,镀层中孔隙较少,电流效率最高,显微硬度达最大值681 HV,此后随电流密度增大镀层显微硬度降低。Compact Fe-W amorphous alloy coating with a high content of W and high hardness was electrodeposited on copper surface.The morphology,microstructure and composition of the alloy coating were analyzed by means of scanning electron microscopy,X-ray diffraction and energy dispersive spectrometry,and the microhardness of the Fe-W alloy coating was also determined.It was found that the Fe-W alloy coatings obtained under different current densities,with thicknesses of 10~100 μm,had amorphous structure and consisted of spherical grains.The amounts of pores in the alloy coatings increased with the increase of current density,and the contents of W in the coatings reached 57%~61%(mass fraction).The highest current efficiency was reached at a current density of 10 A/dm2,and corresponding Fe-W alloy coating contained less amount of pores and had the highest microhardness of 681 HV.Beyond a current density of 10 A/dm2,the microhardness of the alloy coating decreased with increasing current density.

关 键 词：Fe—W镀层 电沉积 紫铜 非晶合金 显微硬度 

分 类 号：TQ153.2[化学工程—电化学工业]