用于高热流密度器件冷却的热管散热器实验研究  

Experimental investigation on heat transfer characteristics of a novel heat pipe radiator used to cool high heat flux device

作　　者：诸凯[1] 李媛媛[1] 陆佩强[1] 

机构地区：[1]天津商业大学天津市制冷技术重点实验室,天津300134

出　　处：《低温与超导》2011年第1期42-46,共5页Cryogenics and Superconductivity

摘　　要：针对大型计算机服务器CPU的耗能量,探讨了一种新的热管排布方式的散热器,并对其散热性能进行了实验研究。研究结果表明,采用此种热管散热器,最高热流密度为74.3W/cm2,其冷却风速控制在4m/s即可满足芯片冷却要求。同时根据模拟计算得到的散热器底板温度分布,可有助于对热管排布方式的优化设计。A novel heat pipe radiator with the different arrangement of heat pipe was used to investigate the heat transfer characteristics aimed to the practical heat flux of CPU in large-scale computer.The research results indicated that the air velocity within 4m/s could satisfy the practical demand under the condition of the maximum heat flux density 74.3W/cm2.In addition,according to the temperature distribution of base plate,optimization design of the arrangement of heat pipe could be proposed.

关 键 词：热控制 热管 散热器 CPU 

分 类 号：TP338.4[自动化与计算机技术—计算机系统结构]