甲基磺酸镀锡添加剂的研究  

A Study of Additives for Methanesulfonic Acid Tin Plating

作　　者：胡立新[1] 程骄[1] 王晓艳[1] 欧阳贵[2] 陈雪梅[3] 

机构地区：[1]湖北工业大学化学与环境工程学院,湖北武汉430068 [2]武汉材料保护研究所,湖北武汉430030 [3]黄石理工学院化工与材料学院,湖北黄石435003

出　　处：《电镀与环保》2011年第1期11-14,共4页Electroplating & Pollution Control

摘　　要：研究了一种新的甲基磺酸镀锡工艺,利用极化曲线、扫描电子显微镜(SEM)、X射线衍射(XRD)等检测方法分析了添加剂对电沉积过程和镀层微观形貌的影响,阐述了添加剂的作用机理。结果表明:镀液的分散能力为58.98%,覆盖能力为100%;添加剂对锡的电沉积过程能够起到很好的阻化作用,有利于晶核形成,提高镀层质量;镀层在生长过程中以(211)和(112)晶面的择优取向协同生长。A new methanesulfonic acid tin plating process was researched.The effects of the additive on the process of tin electrodeposition and surface morphology were examined by polarization curve,scanning electron microscope and X-ray diffraction analysis,at the same time,the mechanism of the additive was discussed.The results show that the throwing power of the bath is 58.98 % and the covering power is 100 %;the cathodic polarization was improved by presence of the additive, which can block active sites for tin deposition and improve the quality of the deposits;moreover,the preferential orientation of crystalline tin grains is（211） and（112） faces.

关 键 词：添加剂 镀锡 电化学性能 微观形貌 取向 

分 类 号：TQ153[化学工程—电化学工业]