N,N-二甲基甲酰胺自组装膜对铜的缓蚀作用  

The Inhibition Effects of N,N-Dimethylformamide Self-assembled Films for Copper

作　　者：相永刚[1] 王春涛[1] 王晶[1] 韩继红[1] 

机构地区：[1]太原师范学院化学系,山西太原300031

出　　处：《电镀与精饰》2011年第1期35-37,共3页Plating & Finishing

摘　　要：将铜电极浸泡在不同浓度的N,N-二甲基甲酰胺溶液中,分别制备了各种自组装膜,用交流阻抗和稳态极化曲线研究了每种自组装膜在中性NaCl溶液中对金属铜的缓蚀作用,结果表明0.1mmol/L的N,N-二甲基甲酰胺溶液的自组装膜在0.5mol/L的NaCl溶液中对铜有较好的缓蚀效果,缓蚀效率为95.97%。The N,N-Dimethylformamide self-assembled films,with different concentration,were prepared on copper electrode surface.Electrochemical impedance spectroscopy（EIS）and Potentiostatic steady-state polarization curve were performed to characterize their inhibition effects for copper in neutral NaCl solution.The results show that the self-assembled film formed in 0.1mmol/L N,N-Dimethylformamide solution has better inhibition effect for copper in 0.5 mol/L NaCl solution.The inhibition efficiency was 95.97%.

关 键 词：自组装膜 交流阻抗 稳态极化 缓蚀 

分 类 号：TQ153.19[化学工程—电化学工业]