相变传热微通道技术的研究进展  

Recent Advances of the Phase Change Micro-channel Cooling Structure

作　　者：王辉[1] 汤勇[2] 余建军[3] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084 [2]华南理工大学机械与汽车工程学院,广州510640 [3]华南理工大学工商管理学院,广州510640

出　　处：《机械工程学报》2010年第24期101-106,共6页Journal of Mechanical Engineering

基　　金：国家自然科学基金联合基金重点(U0834002);华南理工大学中央高校基本科研业务费专项资金(2009ZM0172;2009ZM0121);广东省自然科学基金(10451064101005146;9451064101002828)资助项目

摘　　要：快速增加的系统发热已经成为当代先进微电子芯片系统研发和应用中的一项重大技术挑战。近年来,微通道相变传热试验和理论分析都证实了其具有高热流密度的传热特性,预示这一技术未来在电子通信、航空航天等产业领域的先进微系统散热/冷却应用上的巨大前景。对相变传热微通道研究领域的三个主要方面(微通道内微热流体动力学过程及传热机理、微通道结构与传热特性的影响关系、微通道结构(器件)的制造技术等)的最新研究进展进行了回顾与综述,探讨相关的理论基础和研究方法,并对这一研究领域的发展趋势做了分析和展望。The rapid increase of heat generation level has become a major technical challenge in the development and applications of contemporary advanced microelectronic chip system.In recent years,heat transfer experiments and theoretical analysis of phase change micro-channels have confirmed its high heat flux transfer characteristics,suggesting the great prospects of this technology in advanced micro-system cooling applications in the field of electronic communications,aerospace and other industries.The latest advances in the three main areas of phase change heat transfer micro-channel research micro-thermal fluid dynamics and heat transfer mechanism in micro-channel,the relationship between micro-channel structure and its heat transfer characteristics,and micro-channel structure（devices） manufacturing technology are summarized.Related theories and methods are discussed.And finally,the development trend and prospects of this technology are also analyzed.

关 键 词：微通道 散热 设计制造 

分 类 号：TK124[动力工程及工程热物理—工程热物理]