SAM扫描器件芯/焊结合空洞的失效分析  

Failure Analysis on Scanning Voids in Die Attach of Devices with SAM

作　　者：刘晶[1,2] 邹俊峰 李文石[1] 徐立 

机构地区：[1]苏州大学电子信息学院,江苏苏州215006 [2]英飞凌科技(无锡)有限公司质量管理部,江苏无锡214028

出　　处：《半导体技术》2011年第2期165-168,共4页Semiconductor Technology

基　　金：江苏省高校自然科学研究资助项目(09KJB510017)

摘　　要：超声无损检测是70种无损探伤技术的最热点。扫描声学显微镜(SAM)的原理是声阻抗成像,要求缺陷尺度大于超声波的波长。结合SAM技术中的A-扫描波形分析和C-扫描特征成像,针对由封装引入的分层和空洞缺陷进行失效分析。研究发现:分层定位的关键是A-扫描波形分析中对各界面处反射波的时间位置的判断;基于分层定位的芯/焊结合空洞缺陷的判别,关键是C-扫描图像中灰阶色带的区分(反射率差值)。Ultrasonic nondestructive inspection is the hottest one in 70 kinds of nondestructive testing techniques.The principle of scanning acoustic microscope（SAM） is the imaging with acoustic impedance,and its basic request is that the scale of defect should be greater than the ultrasonic wavelength.Combined with the A-scan waveform analysis and C-scan feature imaging of SAM,the failure of delamination and voids induced by devices packaging was analyzed.The study shows that the key point of delamination location is distinguishing reflected-pulses at each interface from A-scan waveform by the time-location comparison and the key point of judgment to die attach voids based on delamination location is discriminating reflection ratio with grayscale colour bar in C-scan image.

关 键 词：扫描声学显微镜 分层 空洞 反射率 失效分析 芯/焊结合 

分 类 号：TN306[电子电信—物理电子学]