一种醇基低固含量免清洗助焊剂的研制  

Development of an alcohol-based low solid content no-clean flux

作　　者：郑家春[1] 杨晓军[1] 雷永平[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《电子元件与材料》2011年第2期39-42,共4页Electronic Components And Materials

基　　金："十一五"国家科技支撑重点资助项目(No.2006BAE03B02)

摘　　要：通过无铅焊料的焊点铺展及润湿力实验考察了活性剂对助焊剂润湿性能的影响,并据此研制出了一种以乙醇为溶剂、以有机酸和有机胺为活性剂并使用复合表面活性剂的免清洗助焊剂。结果表明:使用复合表面活性剂的助焊剂的润湿效果要好于使用单一表面活性剂的助焊剂。其中,以使用Op—4与壬基酚聚氧乙烯醚质量比为8:1的复合表面活性剂的助焊剂的润湿效果最好,最大润湿力可达6.14mN。制备的免清洗助焊剂无色透明,无刺激性气味,残留物少,润湿性能好,w(不挥发物)小于2%,得到的焊点饱满。The effects of active agent and surfactant on the wettability of flux for lead-free solder were studied by performing the spread test and wetting balance test,and an alcohol-based no-clean flux was developed based on the analysis results.For the developed flux,organic acid and organic amine were employed as the active agent and a kind of mixed surfactant was used.The results show that the wettability of the fluxes with mixed surfactant is significantly improved in comparison to the fluxes with single surfactant.The flux using the mixed surfactant composed of Op—4 and nonylphenol polyoxyethylene in a mass ration of 8：1 shows the highest wettability with the maximum wetting force being 6.14 mN.The developed flux is colorless and transparent,does not release pungent smell,contains less than 2% （mass fraction） non-volatile matter,and shows high wettability and little residue.And,with the application of this flux,the obtained spots are bright and plump.

关 键 词：醇基助焊剂 乙醇 免清洗 

分 类 号：TN604[电子电信—电路与系统]